JUKI KE-2030 Pick and Place Machine

JUKI KE-2030 Pick and Place Machine
JUKI KE-2030 Pick and Place Machine
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Product Code : JUKI KE-2030 Pick and Place Machine
Brand Name : JUKI
Price And Quantity
  • Minimum Order Quantity
  • 1 Set
  • Price
  • 1000 USD ($)
Product Description

JUKI KE-2030 Pick and Place Machine

Introduce of SMT pick and place machine:

juki 2030 is 20000CPH can achieve high-speed performance "double-chip high-speed placement machine."Not only can be used around 2 patch head to mount two substrates at the same time, but also to achieve the same type of mounting the highest efficiency,

The equivalent of two JUKI 2010.

  • PCB size: 330mmX250mm
  • Can be attached to the component range: 0402,0603 chip -26.5X11mm or 20mm square components
  • The number of stations: 60 x 2
  • theoretical chip speed: 20000 (grain / hour)
  • Mounting accuracy: Laser identification  0.08mm
  • Size and weight: L1900 / W1476 / H2000 & 6000KG
  • Weight 1400 (kg)
  • Power three-phase AC200-415 (V)
  • Patch speed 19000CPH (grain / hour)
  • Resolution  0.05mm (mm)
Manufactured in 2000,
  • PCB size: 330mmX250mm
  • Components can be affixed to range: 0402,0603 chip-26.5X11mm or 20mm square components
  • Feed station number: 60 x 2
  • Theory Chip Speed: 20000 (tablets / hour)
  • Placement accuracy:  0.08mm laser identification
  • Size and weight: L1900/W1476/H2000 & 6000KG
  • Power and gas supply: 3PH, 200V, 5KVA
  • Configuration: 0603 2 sets of each nozzle; Manual CD-ROM 1
Specifications
  • Vintage:2004
  • Placement:20,000cph
  • 2 multi nozzle laser heads(8 nozzles)
  • From: 0603 (0201)chip to 26.5 x 11mm chip or 20mm square chip
  • Simultaneous placement of components onto two boards
  • Medium board size: 330 x 250mm
  • Large board size: 410 x 360mm
  • Extra large board size: 510 x 460mm
  • Applicable component height: 6mm, 12-20mm
  • Component size: 25mm, 0603 chip, from 1005 chip
  • to 20mm square chip or 26.5 x 11mm chip.
  • From 1005 chip to 50mm square chip or 50 x 150mm chip
  • Component placement speed: chip, IC: 20,000cph
  • Component placement accuracy: Laser recognition +/- 0.08mm
  • Vision Recognition
Max. unique components: 120 per side using 8mm tape feeders
  • Feeders type available: tape- 8mm, 12mm, 16mm, 24mm, 32mm, 44mm, and 56mm.
  • Stick/ bulk/ tray not available
  • Power: 3 phase 200/220/240 or 380 VAC
  • Compressed Air: 71psi
  • Operating System: Windows NT
  • Programming Methods: On line: teach with placement head, teach camera, key board only
  • Off Line: keyboard entry, CAD data conversion with optional software
  • Program Size: Maximum 3000 placements per circuit, not to exceed 10,000
  • Maximum 100 non-matrix or 400 matrix circuits per PCB.
  • Data entry resolution: X/Y axis 0.0004 (o.01mm)
  • Teta axis (rotation) 0.05
Entry in millimeters or inches
  • Self Calibration: Self calibration routine allows operator
  • to recalibrate at anytime in just minutes
  • Up and Down line connection: SMEMA standard
  • Teach Camera: Allows teaching of pick and placement location with
  • one of two CCD cameras mounted on the head assembly
  • Auto Tool Changer: The two tool changer hold up to fourty-one (41) vacuum nozzle
  • Seventeen (17) vacuum nozzles are standard (8x502, 8x504, 1x508)
  • Placement Heads: Two (2) Multi- Nozzles Laser Align (MNLA) high speed assembley
  • head (total of 8 nozzles) driven by a overhead X/Y gantry positioning
  • System with closed loop twin AC servo motors and magnetic linear encoders
  • Component Pick and Placement Method: Pickup and placement is
  • performated via vacuum nozzle with programmable pick and placement force
  • Component Centering: Non Contact Touch Less Centering (TLC) using Laser Align Sensor
  • Component Detection: Vacuum Sensor and Laser

Trade Information
  • Supply Ability
  • 1000set Per Month
  • Delivery Time
  • 30 Days

FLASON ELECTRONIC CO. LIMITED
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